Design Process:

Part I: Acceptable Specifications

Below are the specifications we determined for the Wireless Information Integration project and the FDIA, compared with current technology.

Category

 2006 Technology

WI2 Project (2026)

CPU Speed

 2 GHz (tablet PCs)

Several hundred GHz

Memory

 64 MB (PDA) to 20 GB

Over 8 TB (terabytes)

Wireless Speed

144 Kbps to 54 Mbps

8 Gbps 

Signal Range

  150 feet (WiFi)

 500 km (any GAN airship)

 Frequencies

 900 MHz to 2.4 GHz;

5 GHz

Equivalent Device(s)

 Cell phone, GPS, PDA, radio, tablet PC, etc.

 FDIA

Part II: Discarding the Deficient Designs

The following are options we considered but rejected:

Direct Neural Interface: Reading your MindA Present-Day, Bulky Example of Neural Interfacing

Some paralysis patients use cranial chips to communicate electronically, but justifying this invasive technology would be difficult.

A current storage medium that can wear out mechanicallyAlternate Storage: Scrapping Solid State

Hard drives break from mechanical wear; solid-state storage looses reliability after a million read-write cycles; dynamic RAM loses data during power loss.

Universal Antennae: One Wavelength Fits All?A modern-day unsightly example of a high-gain antenna

The broad range of frequencies required to encompass all wireless signals rendered universal high-gain antennas unrealistic.

Part III: Prototyping and Design

Here are also visual representations and diagrams (prototypes) explaining Wireless Information Integration technology.

Global Area Network: Click on the pictures for larger diagrams.

An artist's rendition of a GAN airshipA symbolic representation of WI2 without base stations

Flat Display Information Assistant

Click on the Icons below to see prototype animations.

The Layers of the Compact Module

The layers of the FDIA screen

Activating the FDIA

[Compact Module]

[Screen Makeup]

[Activating the FDIA]

 

Sketches of the FDIA Compact Module

 Oblique View of FDIA Compact Module

 Skew View of FDIA Compact Module

 Front View of FDIA Compact Module

 

 

 

Designed for Toshiba's Exploravision Competition
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Wireless Information Integration