Our Future Vision:

How-To's of High-Altitude Networking

How WI2 works: The GAN

The GAN backbone will be several stratosphere-based, autonomous airships, each broadcasting signals over 800,000 sq km. Twenty-four airships covering major metropolitan areas and 12 auxiliary blimps for less populated regions could provide wireless GAN access to the entire US. GAN communication hub stations, interconnected with several 500 Gbps fiber optic landlines, will be built in each region to relay information to the airships with powerful antennae.

Introducing the FDIA

  [Click on Diagram to Expand]

This is a three-view representation of the FDIA's compact module



 An Example of Modern Shape-Memory PolymerA Current ORB prototype by NECThe back of the entire FDIA (screen and compact module) will consist of a 200-micron-thick, biodegradable shape-memory polymer shell. Further, there will be a 100-micron-thick, environmentally friendly ORB (organic radical battery) above the polymer shell in only the compact module.  

Nanospheres for NanolithographyThe FDIA will also integrate nanocircuitry sheets produced by nanosphere lithography, a small-scale “printing” process. The compact module's nanocircuitry will include a CPU, sound and video controllers,A current 1.49 GHz Nano-Antennae MRAM chips, and a microscopic antennae array, which the FDIA will use, along with featuring MIMO technology, to communicate with the GAN and other networks like metropolitan wireless networks.


Previous [Page 1 of Future]

Back to Future Page 1



Designed for Toshiba's Exploravision Competition
Introduction  |  Homepage
Wireless Information Integration